The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 13, 2007

Filed:

Dec. 04, 2003
Applicants:

Mutsuhiko Yoshioka, Tokyo, JP;

Eiji Hayashi, Tokyo, JP;

Norihiko Ikeda, Tokyo, JP;

Inventors:

Mutsuhiko Yoshioka, Tokyo, JP;

Eiji Hayashi, Tokyo, JP;

Norihiko Ikeda, Tokyo, JP;

Assignee:

JSR Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/302 (2006.01);
U.S. Cl.
CPC ...
Abstract

A stopper for chemical mechanical planarization comprising an organosilicon polymer, in particular a polycarbosilane, is provided. The stopper used for polishing wafers with a wiring pattern in the manufacture of semiconductor devices to protect interlayer dielectric films made of a material such as SiO, fluorine dope SiO, or organic or inorganic SOG (Spin-on glass) from damages during the chemical mechanical planarization process.


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