The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 27, 2007

Filed:

Nov. 29, 2004
Applicants:

Seiichiro Kanno, Ibaraki, JP;

Ryoji Nishio, Kudamatsu, JP;

Ken Yoshioka, Hikari, JP;

Saburou Kanai, Hikari, JP;

Hideki Kihara, Kudamatsu, JP;

Hideyuki Yamamoto, Kudamatsu, JP;

Inventors:

Seiichiro Kanno, Ibaraki, JP;

Ryoji Nishio, Kudamatsu, JP;

Ken Yoshioka, Hikari, JP;

Saburou Kanai, Hikari, JP;

Hideki Kihara, Kudamatsu, JP;

Hideyuki Yamamoto, Kudamatsu, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01J 7/24 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method for operating a semiconductor processing apparatus that plasma-processes a semiconductor wafer mounted on a stage placed in a container using a plasma generated therein. The method includes setting a temperature of the semiconductor wafer, and controlling an operation of the semiconductor processing apparatus based on information about the temperature of the semiconductor wafer which is set.


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