The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 13, 2007

Filed:

Aug. 24, 2004
Applicants:

Shih-ping Hsu, Hsin-chu, TW;

Kun-chen Tsai, Hsin-chu, TW;

Inventors:

Shih-Ping Hsu, Hsin-chu, TW;

Kun-Chen Tsai, Hsin-chu, TW;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01K 3/22 (2006.01);
U.S. Cl.
CPC ...
Abstract

An electrical connection terminal of an embedded chip and a method for fabricating the same are disclosed. An insulating layer is provided on a circuit board integrated with a chip and has a plurality of first openings for exposing a conductive pad of the chip. A first metal layer is formed on the conductive pad, and a conductive layer if formed on surfaces of the first metal layer, the insulating layer and the first openings. A patterned resist layer is formed on the conductive layer and has a plurality of second openings for exposing a part of the conductive layer corresponding to the condictive pad of the chip. A second metal layer is formed on the exposed part of the conductive layer by an electroplating process. Thus, the fabrication of conductive structure of the conductive pad of the ship and build-up of conductive circuits on the circuit board are integrated simultaneously.


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