The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 30, 2007
Filed:
Feb. 03, 2005
Applicants:
Gregory M. Chrysler, Chandler, AZ (US);
Abhay A. Watwe, Chandler, AZ (US);
Sairam Agraharam, Phoenix, AZ (US);
Kramadhati V. Ravi, Atherton, CA (US);
Michael C. Garner, Pleasanton, CA (US);
Inventors:
Gregory M. Chrysler, Chandler, AZ (US);
Abhay A. Watwe, Chandler, AZ (US);
Sairam Agraharam, Phoenix, AZ (US);
Kramadhati V. Ravi, Atherton, CA (US);
Michael C. Garner, Pleasanton, CA (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/0312 (2006.01);
U.S. Cl.
CPC ...
Abstract
Processes are described whereby a wafer is manufactured, a die from the wafer, and an electronic assembly including the die. The die has a diamond layer which primarily serves to spread heat from hot spots of an integrated circuit in the die.