The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 16, 2007
Filed:
May. 24, 2005
Yasuhiro Yoshikawa, Kodaira, JP;
Motoo Suwa, Saitama, JP;
Hiroaki Nambu, Sagamihara, JP;
Renesas Technology Corp., Tokyo, JP;
Abstract
A wiring board includes a plurality of wiring layers, and one surface formed with a plurality of chip connecting electrodes and another surface formed with a plurality of external connecting electrodes of a semiconductor device. The wiring board has wiring layers and vias. The plurality of chip connecting electrodes include first chip connecting electrodes, each used for a first signal whose logic value changes, and second chip connecting electrodes, each used for a second signal that changes after a change timing of the first signal. A wiring layer in which wiring routing of paths extending from the first chip connecting electrodes to their corresponding first external connecting electrodes is performed, and a wiring layer in which wiring routing of paths extending from the second chip connecting electrodes disposed adjacent to the first chip connecting electrodes to their corresponding second external connecting electrodes is performed, are made different from each other.