The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 02, 2007
Filed:
Nov. 08, 2004
James A. Fair, Mountain View, CA (US);
Robert H. Havemann, Pleasanton, CA (US);
Jungwan Sung, Santa Clara, CA (US);
Nerissa Taylor, Milpitas, CA (US);
Sang-hyeob Lee, Santa Clara, CA (US);
Mary Anne Plano, Mountain View, CA (US);
James A. Fair, Mountain View, CA (US);
Robert H. Havemann, Pleasanton, CA (US);
Jungwan Sung, Santa Clara, CA (US);
Nerissa Taylor, Milpitas, CA (US);
Sang-Hyeob Lee, Santa Clara, CA (US);
Mary Anne Plano, Mountain View, CA (US);
Novellus Systems, Inc., San Jose, CA (US);
Abstract
A method for creating a refractory metal and refractory metal nitride cap effective for reducing copper electromigration and copper diffusion is described. The method includes depositing a refractory metal nucleation layer and nitriding at least the upper portion of the refractory metal layer to form a refractory metal nitride. Methods to reduce and clean the copper lines before refractory metal deposition are also described. Methods to form a thicker refractory metal layer using bulk deposition are also described.