The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 02, 2007

Filed:

Sep. 01, 2004
Applicants:

Kenji Funatsu, Niigata-Ken, JP;

Tsunehiro Nishi, Niigata-Ken, JP;

Shigehiro Nagura, Niigata-Ken, JP;

Inventors:

Kenji Funatsu, Niigata-Ken, JP;

Tsunehiro Nishi, Niigata-Ken, JP;

Shigehiro Nagura, Niigata-Ken, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/39 (2006.01); G03F 7/30 (2006.01); C08F 124/00 (2006.01); C08F 134/02 (2006.01); C08F 24/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

Provided is a polymer useful as a base resin of a resist material featuring a high resolution, patterns with less sidewall roughness, practically acceptable etching resistance, and a substantial margin allowed for heat treatment temperature after exposure. The polymer has a weight-average molecular weight of from 1,000 to 50,000 and comprises at least one repeating unit of formula (1) below, at least one repeating unit of formula (2) below and at least one repeating unit of formula (3) below. A resist material comprising the polymer is also provided. In addition, provided is a pattern formation process comprising steps of applying the resist material onto a substrate, heating the film, exposing the heated film through a photomask to high energy radiation or electron beam, heating the exposed film and then developing with a developer


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