The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 02, 2007
Filed:
Jun. 17, 2003
Byung Jin Choi, Round Rock, TX (US);
Frank Y. Xu, Austin, TX (US);
Nicholas A. Stacey, Austin, TX (US);
Van Xuan Hong Truskett, Austin, TX (US);
Michael P. C. Watts, Austin, TX (US);
Byung Jin Choi, Round Rock, TX (US);
Frank Y. Xu, Austin, TX (US);
Nicholas A. Stacey, Austin, TX (US);
Van Xuan Hong Truskett, Austin, TX (US);
Michael P. C. Watts, Austin, TX (US);
Molecular Imprints, Inc, Austin, TX (US);
University of Texas Systems, Austin, TX (US);
Abstract
The present invention provides a method to reduce adhesion between a conformable region on a substrate and a pattern of a mold, which selectively comes into contact with the conformable region. The method features forming a conformable material on the substrate and contacting the conformable material with the surface. A conditioned layer is formed from the conformable material. The conditioned layer has first and second sub-portions, with the first sub-portion being solidified and the second sub-portion having a first affinity for the surface and a second affinity for the first sub-portion. The first affinity is greater than the second affinity. In this fashion, upon separation of the mold from the conditioned layer, a subset of the second sub-portion maintains contact with the mold, thereby reducing the probability that a pattern formed in the conditioned layer becomes compromised. These and other embodiments are described herein.