The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 02, 2007
Filed:
Jun. 16, 2003
Katrin Ebner, Dresden, DE;
David Erdmann, Dresden, DE;
Walter Glashauser, Oberhaching, DE;
Lutz Teichgräber, Moritzburg, DE;
Katrin Ebner, Dresden, DE;
David Erdmann, Dresden, DE;
Walter Glashauser, Oberhaching, DE;
Lutz Teichgräber, Moritzburg, DE;
Infineon Technologies SC 300 GmbH & Co. KG, Munich, DE;
Abstract
By applying heat and pressure to a backing film with an adhesive layer while mounting it to a polish head used for chemical mechanical polishing, inhomogeneities inside the adhesive layer, e.g. thickness and compressibility variations or air bubbles can easily be removed. A corresponding configuration includes a device for exerting a uniform pressure force, which can be a roller made of silicone or rubber, or a plate. The configuration also includes a device for heating and a control unit for controlling the heat and the pressure force. After the backing film is installed using this configuration and method, the polish head can be used to uniformly remove material from a semiconductor wafer surface and therefore the wafer yield is advantageously increased.