The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 26, 2006
Filed:
Mar. 18, 2004
Jonathan A. Noquil, Lapu-Lapu, PH;
Seung Yong Choi, Gyeonggi-do, KR;
Rajeev Joshi, San Jose, CA (US);
Chung-lin Wu, San Jose, CA (US);
Jonathan A. Noquil, Lapu-Lapu, PH;
Seung Yong Choi, Gyeonggi-do, KR;
Rajeev Joshi, San Jose, CA (US);
Chung-Lin Wu, San Jose, CA (US);
Fairchild Semiconductor Corporation, South Portland, ME (US);
Abstract
A multichip module package uses bond wire with plastic resin on one side of a lead frame to package an integrated circuit and flip chip techniques to attach one or more mosfets to the other side of the lead frame. The assembled multichip modulehas an integrated circuit controlleron a central die pad. Wire bondsextend from contact areas on the integrated circuit to outer leadsof the lead frame. On the opposite, lower side of the central die pad, the sources and gates of the mosfetsare bump or stud attached to the half etched regions of the lead frame. The drainsof the mosfets and the ball contactson the outer leads are soldered to a printed circuit board.