The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7152319 B1

PDF
Full Text
Expired
Date of Patent:
Dec. 26, 2006

Filed:

Mar. 30, 2004
Applicants:

Benson Chan, Vestal, NY (US);

John M. Lauffer, Waverly, NY (US);

How T. Lin, Vestal, NY (US);

Voya R. Markovich, Endwell, NY (US);

David L. Thomas, Vestal, NY (US);

Inventors:

Benson Chan, Vestal, NY (US);

John M. Lauffer, Waverly, NY (US);

How T. Lin, Vestal, NY (US);

Voya R. Markovich, Endwell, NY (US);

David L. Thomas, Vestal, NY (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01K 3/10 (2006.01);
U.S. Cl.
CPC ...
Abstract

A multilayered PCB including two multilayered portions, one of these able to electrically connect electronic components mounted on the PCB to assure high frequency connections therebetween. The PCB further includes a conventional PCB portion to reduce costs while assuring a structure having a satisfactory overall thickness for use in the PCB field. Coupling is also possible to the internal portion from these components. Methods of making these structures have also been provided.


Find Patent Forward Citations

Chan, Benson. (2006). Method of making high speed circuit board (U.S. Patent No. 7152319). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7152319

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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