The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 19, 2006
Filed:
Oct. 12, 2005
Shih-ping Hsu, Hsin-chu, TW;
Sao-hsia Tang, Hsin-chu, TW;
Chao-wen Shih, Hsin-chu, TW;
Ying-tung Wang, Hsin-chu, TW;
Wen-hung HU, Hsin-chu, TW;
Shih-Ping Hsu, Hsin-chu, TW;
Sao-Hsia Tang, Hsin-chu, TW;
Chao-Wen Shih, Hsin-chu, TW;
Ying-Tung Wang, Hsin-chu, TW;
Wen-Hung Hu, Hsin-chu, TW;
Abstract
A method for fabricating an electrical connection structure of a circuit board is proposed. A patterned resist layer is formed on the circuit board having a plurality of conductive pads, and a plurality of openings is formed in the resist layer to expose the conductive pads. A first conductive material and a second conductive material are successively deposited in the openings of the resist layer and on each of the conductive pads. Then, the resist layer is removed. Subsequently, a protective layer is applied on the circuit board and covers the first and second conductive materials formed on each of the conductive pads. Finally, the protective layer is thinned to expose the second conductive material corresponding in position to each of the conductive pads. Thus, the circuit board can be electrically connected to an external device via the second conductive material.