The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 28, 2006
Filed:
Aug. 29, 2005
Antonio B. Dimaano, Jr., Singapore, SG;
Byung Tai DO, Singapore, SG;
Dennis Guillermo, Singapore, SG;
Sheila Rima C. Magno, Singapore, SG;
Antonio B. Dimaano, Jr., Singapore, SG;
Byung Tai Do, Singapore, SG;
Dennis Guillermo, Singapore, SG;
Sheila Rima C. Magno, Singapore, SG;
Stats Chippac Ltd., Singapore, SG;
Abstract
A die is attached to a substrate and is enclosed in a heat spreader, the heat spreader having a first encapsulant guide and a heat spreader air vent in the heat spreader extending therethrough. An encapsulant encapsulates the die, the substrate, at least a portion of the heat spreader, the first encapsulant guide, and the heat spreader air vent such that the encapsulant enters the heat spreader through the first encapsulant guide and air exits the heat spreader through the heat spreader air vent, thus preventing the formation of air pockets under the heat spreader.