The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 21, 2006
Filed:
Sep. 10, 2003
Seiichiro Kanno, Chiyoda, JP;
Ken Yoshioka, Hikari, JP;
Ryoji Nishio, Kudamatsu, JP;
Saburou Kanai, Hikari, JP;
Hideki Kihara, Kudamatsu, JP;
Koji Okuda, Kudamatsu, JP;
Seiichiro Kanno, Chiyoda, JP;
Ken Yoshioka, Hikari, JP;
Ryoji Nishio, Kudamatsu, JP;
Saburou Kanai, Hikari, JP;
Hideki Kihara, Kudamatsu, JP;
Koji Okuda, Kudamatsu, JP;
Hitachi High-Technologies Corporation, Tokyo, JP;
Abstract
A wafer processing method for use with a wafer processing apparatus having a liquid cooling jacket with a built-in coolant liquid circulation path and a ceramic plate as attached onto the liquid cooling jacket and having therein a heater and an electrode for an electrostatic chuck. The method enables performance of wafer processing while letting a wafer be mounted on the ceramic plate by a wafer transport. The method includes causing the wafer transport to transport the wafer onto the ceramic plate, pre-heating the wafer while the wafer is held on the ceramic plate for a predetermined length of time, and mounting the preheated wafer on the ceramic plate.