The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 14, 2006
Filed:
Dec. 16, 2004
Katsunori Hirano, Yokohama, JP;
Shuji Kikuchi, Yokohama, JP;
Yuji Sonoda, Hiratsuka, JP;
Wen LI, Yokohama, JP;
Tadanobu Toba, Yokohama, JP;
Takashi Kanesaka, Kokubunji, JP;
Masayuki Takahashi, Hachioji, JP;
Katsunori Hirano, Yokohama, JP;
Shuji Kikuchi, Yokohama, JP;
Yuji Sonoda, Hiratsuka, JP;
Wen Li, Yokohama, JP;
Tadanobu Toba, Yokohama, JP;
Takashi Kanesaka, Kokubunji, JP;
Masayuki Takahashi, Hachioji, JP;
Hitachi, Ltd., Tokyo, JP;
Elpida Memory, Inc., Tokyo, JP;
Abstract
Semiconductor testing equipment according to the present invention comprises: an algorithmic pattern generator for generating a test pattern for testing a memory under test and applying the pattern to the memory under test; a comparator for comparing a response signal from the memory under test and an expected value from tho algorithmic pattern generator; a fail address acquisition part for storing an address of the memory under test (fail address) when a result compared by the comparator is failed; a fail address analysis part for analyzing the failed address and calculating the address to be repaired (repair address); and a cycle-pattern generator for redundancy processing for inserting the address to be repaired into a test pattern and applying the address to the memory under test, so that even when capacity of the semiconductor memory is increased, a fabrication yield thereof is raised by testing the memory after the packaging and by performing the redundancy processing of a defective.