The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 14, 2006

Filed:

Mar. 31, 2003
Applicants:

Scott J. Bukofsky, Hopewell Junction, NY (US);

John K. Debrosse, Colchester, VT (US);

Marco Hug, South Burlington, VT (US);

Lars W. Liebmann, Poughquag, NY (US);

Daniel J. Nickel, Westford, VT (US);

Juergen Preuninger, Munich, DE;

Inventors:

Scott J. Bukofsky, Hopewell Junction, NY (US);

John K. DeBrosse, Colchester, VT (US);

Marco Hug, South Burlington, VT (US);

Lars W. Liebmann, Poughquag, NY (US);

Daniel J. Nickel, Westford, VT (US);

Juergen Preuninger, Munich, DE;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G01F 9/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A phase shift mask shape that reduces line-end shortening at the critical feature without changing layout size increases required of requisite phase shift rules. The phase feature is given an angled extension, which includes the lithographic shortening value. This allows the critical shape to be designed much closer to the reference layer then it could without the angled extension feature. Phase mask extension features beyond a given device segment are significantly reduced by lengthening the feature along an uncritical portion; moving the feature reference point to the device layer; and flattening the phase extension feature into an L-shape or T-shape along the uncritical parts of a device segment. Applying these design rules allows a draw of the gate conductor under current conditions and puts phase shapes inside without extending the gate conductor dimensions to the next feature.


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