The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 19, 2006

Filed:

Jul. 25, 2005
Applicants:

Norio Kimura, Fujisawa, JP;

Mitsuhiko Shirakashi, Fujisawa, JP;

Katsuya Okumura, Tokyo, JP;

You Ishii, Yokohama, JP;

Junji Kunisawa, Yamato, JP;

Hiroyuki Yano, Yokohama, JP;

Inventors:

Norio Kimura, Fujisawa, JP;

Mitsuhiko Shirakashi, Fujisawa, JP;

Katsuya Okumura, Tokyo, JP;

You Ishii, Yokohama, JP;

Junji Kunisawa, Yamato, JP;

Hiroyuki Yano, Yokohama, JP;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 7/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A polishing apparatus and method has a function of polishing a surface of a film formed on a substrate to a flat mirror finish and a function of polishing unnecessary metal film such as copper film deposited on an outer peripheral portion of the substrate to remove such unnecessary metal film. The polishing apparatus comprises a surface polishing mechanism comprising a polishing table having a polishing surface and a top ring for holding the substrate and pressing the substrate against the polishing surface of the polishing table to thereby polish a surface of the substrate, and an outer periphery polishing mechanism for polishing an outer peripheral portion of the substrate.


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