The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 19, 2006

Filed:

Oct. 14, 2003
Applicants:

Raschid J Bezama, Mahopac, NY (US);

William W Harkins, Montgomery, NY (US);

David C Long, Wappingers Falls, NY (US);

Jason S Miller, Poughkeepsie, NY (US);

Christopher E Pepe, Middletown, NY (US);

Ronald M Rothkranz, Staatsburg, NY (US);

John a Rudy, Wappingers Falls, NY (US);

Benjamin P Tongue, New Paltz, NY (US);

Inventors:

Raschid J Bezama, Mahopac, NY (US);

William W Harkins, Montgomery, NY (US);

David C Long, Wappingers Falls, NY (US);

Jason S Miller, Poughkeepsie, NY (US);

Christopher E Pepe, Middletown, NY (US);

Ronald M Rothkranz, Staatsburg, NY (US);

John A Rudy, Wappingers Falls, NY (US);

Benjamin P Tongue, New Paltz, NY (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B41L 13/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method and apparatus for the rapid cooling of screen masks used in the fabrication of semiconductor components is provided. The method and apparatus use a specially designed cooling plate which is contacted with a mask frame holding the screening mask. After a heated cleaning step which cleans the mask frame and screening mask of metal paste used in the screening operation, the cooling plate having one or more concave lower surfaces contacts the upper surfaces of the mask frame and bends the mask frame in the shape of the concave surfaces. This ensures intimate contact between the cooling plate and mask frame and enhances the thermal efficiency of the cooling step.


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