The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 12, 2006
Filed:
Jul. 22, 2002
Osamu Tamada, Kyoto, JP;
Tsuyoshi Mitsuhashi, Kyoto, JP;
Minobu Matsunaga, Kyoto, JP;
Katsushi Yoshioka, Kyoto, JP;
Kenji Sugimoto, Kyoto, JP;
Kaoru Aoki, Kyoto, JP;
Moritaka Yano, Kyoto, JP;
Satoshi Yamamoto, Kyoto, JP;
Masakazu Sanada, Kyoto, JP;
Takashi Nagao, Kyoto, JP;
Mitsumasa Kodama, Kyoto, JP;
Osamu Tamada, Kyoto, JP;
Tsuyoshi Mitsuhashi, Kyoto, JP;
Minobu Matsunaga, Kyoto, JP;
Katsushi Yoshioka, Kyoto, JP;
Kenji Sugimoto, Kyoto, JP;
Kaoru Aoki, Kyoto, JP;
Moritaka Yano, Kyoto, JP;
Satoshi Yamamoto, Kyoto, JP;
Masakazu Sanada, Kyoto, JP;
Takashi Nagao, Kyoto, JP;
Mitsumasa Kodama, Kyoto, JP;
Abstract
A substrate treating apparatus is provided for eliminating wasteful consumption of a treating solution in a treating mode in which the treating solution is delivered in a strip form to a substrate from a treating solution delivery nozzle sweeping over the substrate. In a first aspect of the invention, collecting vessels are arranged around a developing cup surrounding a wafer supported by a wafer holder. The collecting vessels collect part of a developer delivered from a discharge opening of a developer delivery nozzle outwardly of a surface of the wafer. In a second aspect of the invention, collecting vessels are arranged below a developer delivery nozzle, with collecting openings of the collecting vessels opposed to a discharge opening or openings of the delivery nozzle. The collecting vessels are moved longitudinally of the discharge openings according to a position of the developer delivery nozzle relative to the wafer.