The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 05, 2006
Filed:
Jan. 31, 2003
Jung-pin Huang, Taichung, TW;
Chin-thuang Chang, Taichung, TW;
Chin-tien Chiu, Taichung, TW;
Abstract
A semiconductor package with a chip supporting structure is provided, including a lead frame having a die pad and a plurality of leads, and a plurality of chip supporting members mounted on the die pad. Each of the chip supporting members has a first surface and an opposing second surface and has an identical height. After the second surfaces of the chip supporting members are attached to the die pad, the first surfaces of the chip supporting members are coplanarly arranged, and a chip is mounted on the first surfaces of the chip supporting members, making the chip supporting members interposed between the chip and die pad. A molding resin for encapsulating the chip is allowed to penetrate through and fill into gaps between the chip and die pad, so as to prevent void formation and assure quality of fabricated products.