The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 05, 2006
Filed:
Oct. 30, 2003
Takashi Noma, Ota, JP;
Hiroyuki Shinogi, Oizumi-machi, JP;
Akira Suzuki, Ota, JP;
Yoshinori Seki, Oizumi-machi, JP;
Koichi Kuhara, Oizumi-machi, JP;
Yukihiro Takao, Nitta-machi, JP;
Hiroshi Yamada, Oizumi-machi, JP;
Takashi Noma, Ota, JP;
Hiroyuki Shinogi, Oizumi-machi, JP;
Akira Suzuki, Ota, JP;
Yoshinori Seki, Oizumi-machi, JP;
Koichi Kuhara, Oizumi-machi, JP;
Yukihiro Takao, Nitta-machi, JP;
Hiroshi Yamada, Oizumi-machi, JP;
Sanyo Electric Co., Ltd., Osaka, JP;
Abstract
A first glass substrate is bonded through a resin to a top surface of a semiconductor wafer on which a first wiring is formed. A second glass substrate is bonded to a back surface of the semiconductor wafer through a resin. A V-shaped groove is formed by notching from a surface of the second glass substrate through a part of the first glass substrate. A second wiring connected with the first wiring and extending to the surface of the second glass substrate is formed. A protection film composed of an organic resin and a photoresist layer to provide the protection film with an opening are formed on the second wiring by spray coating. A conductive terminal is formed by screen printing using the protection film as a solder mask. A cushioning material may be formed on the second glass substrate by spray coating.