The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 29, 2006

Filed:

Oct. 31, 2003
Applicants:

Michael Warner, San Jose, CA (US);

Masud Beroz, Livermore, CA (US);

David Light, Los Gatos, CA (US);

Delin LI, San Jose, CA (US);

Dennis Castillo, Milpitas, CA (US);

Hung-ming Wang, San Jose, CA (US);

John W. Smith, Horseshoe Bay, TX (US);

Inventors:

Michael Warner, San Jose, CA (US);

Masud Beroz, Livermore, CA (US);

David Light, Los Gatos, CA (US);

Delin Li, San Jose, CA (US);

Dennis Castillo, Milpitas, CA (US);

Hung-ming Wang, San Jose, CA (US);

John W. Smith, Horseshoe Bay, TX (US);

Assignee:

Tessera, Inc., San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01); H01L 21/48 (2006.01); H01L 21/50 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method is disclosed for making a microelectronic package. A material is applied to a first major surface of a microelectronic element to reduce the heights of protrusions projecting from the first major surface. The microelectronic element is assembled to a microelectronic component. A method of forming protrusions and an assembly incorporating the microelectronic element having protrusions is also disclosed.


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