The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 29, 2006
Filed:
Sep. 13, 2002
Applicants:
Isamu Satou, Souka, JP;
Shinichi Nomoto, Hanyu, JP;
Hiroshi Okada, Souka, JP;
Inventors:
Assignee:
Senju Metal Industry Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 35/14 (2006.01);
U.S. Cl.
CPC ...
Abstract
A solder ball is formed from an Sn—Pb alloy which consists essentially of about 2–65 mass % of Sn, 0–5 mass % of Ag, about 0.1–1 mass % of Sb, and 0.01–0.1 mass % of Cu, and 0.01–0.1 mass % of Bi, and a balance of Pb and incidental impurities. The solder ball has improved thermal fatigue resistance, good solderability, and good surface brightness after soldering.