The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 22, 2006
Filed:
Nov. 21, 2003
Chuen-rong Leu, Hsinchu, TW;
Charles W. C. Lin, Singapore, SG;
Chuen-Rong Leu, Hsinchu, TW;
Charles W. C. Lin, Singapore, SG;
Bridge Semiconductor Corporation, Taipei, TW;
Abstract
A method of making a semiconductor chip assembly includes forming a routing line on a metal base, etching the metal base wherein an unetched portion of the metal base forms a pillar, mechanically attaching a semiconductor chip to the routing line and the pillar wherein the chip includes a conductive pad, the routing line extends laterally from the pillar towards the chip and the chip and the pillar extend vertically beyond the routing line in the same direction, forming an encapsulant wherein the chip and the pillar are embedded in the encapsulant, and forming a connection joint that electrically connects the routing line and the pad.