The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 22, 2006
Filed:
Sep. 15, 2003
Kei Imafuji, Nagano, JP;
Tadashi Kodaira, Nagano, JP;
Takeshi Chino, Nagano, JP;
Jyunichi Nakamura, Nagano, JP;
Miwa Abe, Nagano, JP;
Kei Imafuji, Nagano, JP;
Tadashi Kodaira, Nagano, JP;
Takeshi Chino, Nagano, JP;
Jyunichi Nakamura, Nagano, JP;
Miwa Abe, Nagano, JP;
Shinko Electric Industries Co., Ltd., Nagano, JP;
Abstract
A wiring substrate with bumps protruding from a surface of the substrate covers one side of a metallic base with an electrical insulating film thereon, having open holes exposing the base, etching the base through the open holes to form concavities in the base, electroplating the interior faces of the concavities to form a barrier metal film thereon filling the concavities with a bump material by electroplating, and forming a barrler layer on the bump material in each concavity. A stack of wiring patterns is formed on the insulating film, adjacent wiring patterns being separated by a respective intervening insulating layer and being electrically connected to each other through vias in the intervening insulating layer, and to the bump material filled in the concavities. Thereafter, the base and barrier metal film are removed.