The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 15, 2006
Filed:
Jun. 17, 2003
Henner W. Meinhold, Fremont, CA (US);
Wayne Cai, Milpitas, CA (US);
Mark L. Rea, Hayward, CA (US);
Sachin M. Chinchwadkar, Milpitas, CA (US);
Henner W. Meinhold, Fremont, CA (US);
Wayne Cai, Milpitas, CA (US);
Mark L. Rea, Hayward, CA (US);
Sachin M. Chinchwadkar, Milpitas, CA (US);
Novellus Systems, Inc., San Jose, CA (US);
Abstract
In one embodiment, an integrated circuit (IC) fabrication material is dispensed from a print head by dividing its nozzles into several groups, and sequentially allowing each group to fire. The nozzles may be grouped based on the amounts of material they dispense. For example, the nozzles may be grouped by drop volume or drop mass. In one embodiment, an IC fabrication material is dispensed on a substrate by controlling a firing sequence of a nozzle to promote merging of material on the substrate. The firing sequence may also be altered to take into account the firing sequence of adjacent nozzles.