The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 08, 2006
Filed:
Jun. 18, 2004
Jaime A. Bayan, Palo Alto, CA (US);
Ashok S. Prabhu, San Jose, CA (US);
Shaw Wei Lee, Cupertino, CA (US);
Jaime A. Bayan, Palo Alto, CA (US);
Ashok S. Prabhu, San Jose, CA (US);
Shaw Wei Lee, Cupertino, CA (US);
National Semiconductor Corporation, Santa Clara, CA (US);
Abstract
A solder pad configuration for use in an IC package is described. Various embodiments of the invention describe IC packages, lead-frames, or substrate panels configured with generally noncircular solder pads at their bottom surfaces. The noncircular shapes allow for greater surface area than circular solder pads having diameters equal to a major dimension of the noncircular shapes, while maintaining the same metal-to-metal clearance between the pads and adjacent leads. This increased surface area provides for stronger and more reliable solder joints.