The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 01, 2006

Filed:

Aug. 21, 2002
Applicants:

Joachim Wienecke, Jena, DE;

Kuno Backhaus, Zoellnitz, DE;

Inventors:

Joachim Wienecke, Jena, DE;

Kuno Backhaus, Zoellnitz, DE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01N 21/00 (2006.01); G01N 21/86 (2006.01); G01N 21/88 (2006.01); G01R 31/26 (2006.01);
U.S. Cl.
CPC ...
Abstract

The invention concerns an arrangement () for inspecting preferably unpatterned wafers, and comprises: a first optical inspection device () for examining reference wafers (R), which operates using image data processing methods and thereby recognizes defects on the reference wafers; a scattered-light measuring instrument () that is calibrated with the reference wafers (R) by defining at least one threshold value for the recognition of defects on wafers (W) to be inspected, and that comprises means () for recording the locations of threshold value exceedances for the wafers (W) to be inspected; and a second optical inspection device () for examination, only at those locations at which a threshold value exceedance is identified, of the wafers (W) to be inspected, which also comprises a classification device. The scattered-light measuring instrument () and the second optical inspection device () are arranged in one production line (P) as sequentially located stations. The first optical inspection device (), on the other hand, is arranged outside the production line (P). A corresponding method is also described.


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