The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 01, 2006

Filed:

Jun. 02, 2004
Applicants:

Masahiro Sunohara, Nagano, JP;

Kei Murayama, Nagano, JP;

Naohiro Mashino, Nagano, JP;

Mitsutoshi Higashi, Nagano, JP;

Inventors:

Masahiro Sunohara, Nagano, JP;

Kei Murayama, Nagano, JP;

Naohiro Mashino, Nagano, JP;

Mitsutoshi Higashi, Nagano, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
Abstract

A wiring substrate including a predetermined wiring pattern, an electronic parts connection terminal on an element forming surface of which is flip-chip connected to the wiring pattern, an insulating film for covering the electronic parts, a via hole formed in a predetermined portion of the electronic parts and the insulating film on the connection terminal, and an overlying wiring pattern formed on the insulating film and connected to the connection terminal via the via hole.


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