The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 25, 2006
Filed:
Aug. 10, 2004
Wai Lo, Lake Oswego, OR (US);
Hong Lin, Vancouver, WA (US);
Shiqun Gu, Vancouver, WA (US);
Wilbur G. Catabay, Saratoga, CA (US);
Zhihai Wang, Sunnyvale, CA (US);
Wei-jen Hsia, Saratoga, CA (US);
Wai Lo, Lake Oswego, OR (US);
Hong Lin, Vancouver, WA (US);
Shiqun Gu, Vancouver, WA (US);
Wilbur G. Catabay, Saratoga, CA (US);
Zhihai Wang, Sunnyvale, CA (US);
Wei-Jen Hsia, Saratoga, CA (US);
LSI Logic Corporation, Milpitas, CA (US);
Abstract
An improvement to a method of forming an integrated circuit. An etch stop layer is formed to overlie the front end processing layers of the integrated circuit. Support structures are formed that are disposed so as to support electrically conductive interconnects on various levels of the integrated circuit. Substantially all of the non electrically conductive layers above the etch stop layer that were formed during the fabrication of the interconnects are removed.