The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 25, 2006
Filed:
Sep. 26, 2001
Yorishige Matsuba, Ibaraki, JP;
Yoshihisa Misawa, Ibaraki, JP;
Hideyuki Goto, Ibaraki, JP;
Masayuki Ueda, Ibaraki, JP;
Katsuhisa Oosako, Ibaraki, JP;
Masaaki Oda, Chiba, JP;
Norimichi Saito, Chiba, JP;
Toshihiro Suzuki, Chiba, JP;
Noriyuki Abe, Chiba, JP;
Yorishige Matsuba, Ibaraki, JP;
Yoshihisa Misawa, Ibaraki, JP;
Hideyuki Goto, Ibaraki, JP;
Masayuki Ueda, Ibaraki, JP;
Katsuhisa Oosako, Ibaraki, JP;
Masaaki Oda, Chiba, JP;
Norimichi Saito, Chiba, JP;
Toshihiro Suzuki, Chiba, JP;
Noriyuki Abe, Chiba, JP;
Harima Chemicals, Inc., Hyogo, JP;
ULVAC, Inc., Kanagawa, JP;
Abstract
This invention provides a low-temperature sintering conductive paste for high density circuit printing which can form a fine circuit having good adhesive force, a smooth surface and low resistance when applied on a substrate and then baked; the conductive paste of the invention uses, as conductive media, in combination with metal fillers having an average particle diameter of 0.5 to 20 μm, ultrafine metal particles having an average particle diameter of not larger than 100 nm, which are set in the state that the surfaces thereof are coated with one compound or more having a group comprising a nitrogen, oxygen, or sulfur atom and capable of coordinate-bonding by a lone pair existing in the atom, as a group capable of coordinate-bonding to a metal element contained in the ultrafine metal particles, and are dispersed uniformly in a resin composition comprising a heat curable resin component, an organic acid anhydride or a derivative thereof or an organic acid, and one or more organic solvent; and thereby it enables low-temperature sintering of the ultrafine metal particles during a heat treatment at a low temperature.