The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 18, 2006
Filed:
Sep. 30, 2004
Heung-kyu Kwon, Kyungki-do, KR;
Se-yong OH, Seoul, KR;
Min-ha Kim, Chungcheongnam-do, KR;
Tae-je Cho, Chungcheongnam-do, KR;
Heung-Kyu Kwon, Kyungki-do, KR;
Se-Yong Oh, Seoul, KR;
Min-Ha Kim, Chungcheongnam-do, KR;
Tae-Je Cho, Chungcheongnam-do, KR;
Samsung Elelctronics Co., Ltd., Suwon-si, KR;
Abstract
Semiconductor packages are provided to prevent a chip, such as a central processing unit (CPU) chip, from being degraded due to hot spot heat generated during the operation of the chip and absorbs thermomechanical stresses in interfaces between the chip, a thermal interface material (TIM) and a lid. The chip is electrically connected, e.g., flip-chip bonded, to a package substrate. The lid is thermally connected to and disposed over a back surface of the chip with the TIM interposed therebetween. A heat dissipation means adjacent the TIM is also located between the lid and the chip to prevent the hot spot effect.