The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 11, 2006
Filed:
Dec. 10, 2003
Applicants:
Takahiro Ikeda, Kanagawa, JP;
Daisuke Kawamura, Kanagawa, JP;
Hisako Aoyama, Kanagawa, JP;
Inventors:
Assignee:
Kabushiki Kaisha Toshiba, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
G01N 21/86 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method of selecting a pattern to be measured includes selecting only points from a combination of all factors effecting dimensional fluctuations. For example, fluctuation between wafers, fluctuation in a wafer, and fluctuation in a chip are candidates for measurement points of patterns to be measured. Further, the number of the selected points corresponds to a divisor of the combination of all factors.
Ikeda, Takahiro. (2006). Method of selecting pattern to be measured, pattern inspection method, manufacturing method of semiconductor device, program, and pattern inspection apparatus (U.S. Patent No. 7075098). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7075098
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile