The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 04, 2006
Filed:
Mar. 25, 2004
Yasuaki Yokoyama, Tokyo, JP;
Isamu Yonekura, Tokyo, JP;
Takashi Satoh, Osaka, JP;
Tamaki Wakasaki, Osaka, JP;
Yasumasa Takeuchi, Kawasaki, JP;
Masayuki Endo, Kawasaki, JP;
Yasuaki Yokoyama, Tokyo, JP;
Isamu Yonekura, Tokyo, JP;
Takashi Satoh, Osaka, JP;
Tamaki Wakasaki, Osaka, JP;
Yasumasa Takeuchi, Kawasaki, JP;
Masayuki Endo, Kawasaki, JP;
JSR Corporation, Tokyo, JP;
Sharp Corporation, Osaka, JP;
International Center for Materials Research, Kawasaki, JP;
Abstract
There is provided a method for forming wiring or an electrode by coating a substrate with a composition comprising (A) a complex of an amine compound and a hydrogenated aluminum compound and (B) a titanium compound or a composition comprising the complex and (C) metal particles and subjecting the obtained coating film to heating and/or a light treatment. By the method, a film can be formed that uses a conductive film forming composition with which wiring and an electrode that can be suitably used for electronic devices can be formed easily and inexpensively.