The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 27, 2006
Filed:
Apr. 12, 2005
Hideo Aoki, Yokohama, JP;
Naoko Yamaguchi, Yokohama, JP;
Chiaki Takubo, Tokyo, JP;
Toshiaki Yamauchi, Fujisawa, JP;
Koji Imamiya, Kawasaki, JP;
Hiroshi Hashizume, Hino, JP;
Hideo Aoki, Yokohama, JP;
Naoko Yamaguchi, Yokohama, JP;
Chiaki Takubo, Tokyo, JP;
Toshiaki Yamauchi, Fujisawa, JP;
Koji Imamiya, Kawasaki, JP;
Hiroshi Hashizume, Hino, JP;
Kabushiki Kaisha Toshiba, Tokyo, JP;
Toshiba TEC Corporation, Tokyo, JP;
Abstract
According to an embodiment of the present invention, a method of producing an electronic circuit comprises printing first metal-containing resin particles which consist of at least a thermosetting resin and fine metal particles and second metal-containing resin particles which consist of at least a thermoplastic resin and fine metal particles by electrophotography to form a first base pattern which consists of the first metal-containing resin particles and a second base pattern which consists of the second metal-containing resin particles on a substrate; forming a first metal conductor layer on the first and second base patterns; forming a second metal conductor layer on the first metal conductor layer by electrolytic plating by supplying electric current to the first metal conductor layer; and removing the second base pattern and the first and second metal conductor layers which are formed on the second base pattern.