The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7067379 B1

PDF
Full Text
Expired
Date of Patent:
Jun. 27, 2006

Filed:

Jan. 08, 2004
Applicants:

Cheng-kuo Wen, Hsinchu, TW;

Yee-chia Yeo, Singapore, SG;

Hsun-chih Tsao, Hsun-Chu, TW;

Inventors:

Cheng-Kuo Wen, Hsinchu, TW;

Yee-Chia Yeo, Singapore, SG;

Hsun-Chih Tsao, Hsun-Chu, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/336 (2006.01); H01L 21/3205 (2006.01); H01L 21/4763 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method in which a gate and raised source/drain (S/D) regions are fully silicided in separate steps to avoid degrading the resistance or junction leakage is described. A gate dielectric layer, gate, and spacers are formed over a semiconductor layer that is preferably Si, SiGe, or SiGeC on a buried insulator. Raised S/D regions are formed by selective epitaxy between spacers and isolation regions. The gate is protected with a mask while the raised S/D regions are covered with a first metal layer. A first anneal affords fully silicided S/D regions. A dielectric stack is deposited on the substrate and planarized to be coplanar with the top of the spacers. The mask is removed and a second metal layer is deposited. A second anneal yields a fully silicided gate electrode. The invention is also an SOI transistor with silicided raised S/D regions and a fully silicided and optionally recessed gate.


Find Patent Forward Citations

Loading…