The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 27, 2006
Filed:
Apr. 16, 2004
Naoyuki Koizumi, Nagano, JP;
Kei Murayama, Nagano, JP;
Takashi Kurihara, Nagano, JP;
Mitsutoshi Higashi, Nagano, JP;
Naoyuki Koizumi, Nagano, JP;
Kei Murayama, Nagano, JP;
Takashi Kurihara, Nagano, JP;
Mitsutoshi Higashi, Nagano, JP;
Shinko Electric Industries Co., Ltd., Nagano, JP;
Abstract
A method for manufacturing a semiconductor package, the method including the steps of attaching a bottom surface of a semiconductor wafer to a first supporting member, forming a through hole in the semiconductor wafer, separating the semiconductor wafer from the first supporting member, forming an insulating layer on at least the bottom surface of the semiconductor wafer and the inner wall of the through hole, forming a conducting layer underneath the semiconductor wafer, the conducting layer spanning at least the bottom of the through hole; and forming a conductive member in the through hole and in electrical contact with the conducting layer.