The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 20, 2006
Filed:
Aug. 31, 2004
Applicants:
Seng Guan Chow, Singapore, SG;
Ming Ying, Singapore, SG;
IL Kwon Shim, Singapore, SG;
Roger Emigh, Mesa, AZ (US);
Inventors:
Seng Guan Chow, Singapore, SG;
Ming Ying, Singapore, SG;
Il Kwon Shim, Singapore, SG;
Roger Emigh, Mesa, AZ (US);
Assignee:
Stats Chippac Ltd., Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor package includes a substrate. A crenellated spacer is attached to the substrate. At least one top die is attached to the crenellated spacer. The at least one top die is wire bonded to the substrate, and an encapsulant is formed over the crenellated spacer and the at least one top die.