The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 20, 2006
Filed:
Mar. 24, 2003
Applicants:
William H. Mullee, Portland, OR (US);
Marc DE Leeuwe, Templeton, CA (US);
Glenn A. Roberson, Jr., Hollister, CA (US);
Bentley J. Palmer, Phoenix, AZ (US);
Inventors:
William H. Mullee, Portland, OR (US);
Marc de Leeuwe, Templeton, CA (US);
Glenn A. Roberson, Jr., Hollister, CA (US);
Bentley J. Palmer, Phoenix, AZ (US);
Assignee:
Tokyo Electron Limited, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/302 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method of post chemical mechanical polishing (CMP) cleaning to remove a CMP residue from a surface of an object is disclosed. The object is placed within a pressure chamber. The pressure chamber is pressurized. A supercritical carbon dioxide process is performed to remove a residual CMP residue from the surface of the object. The pressure chamber is vented.