The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 20, 2006
Filed:
Aug. 17, 2001
Eugene Y. Ivanov, Grove City, OH (US);
David B. Smathers, Columbus, OH (US);
Charles E. Wickersham, Jr., Columbus, OH (US);
John E. Poole, Grove City, OH (US);
Eugene Y. Ivanov, Grove City, OH (US);
David B. Smathers, Columbus, OH (US);
Charles E. Wickersham, Jr., Columbus, OH (US);
John E. Poole, Grove City, OH (US);
Tosoh SMD, Inc., Grove City, OH (US);
Abstract
A preferred sputter target assembly (') comprises a target (′), a backing plate (′) bonded to the target (′) along an interface (′) and dielectric particles (′) between the target (′) and the backing plate (′). A preferred method for manufacturing the sputter target assembly (′) comprises the steps of providing the target (′) and the backing plate (′); distributing the dielectric particles (′) between mating surfaces () of the target (′) and the backing plate (′), most preferably along a sputtering track pattern on one of the mating surfaces; and bonding the target (′) to the backing plate (′) along the mating surfaces (). A preferred method for sputtering in accordance with the invention comprises the steps of applying electrical power to the sputter target (); causing the sputter target assembly () to produce an electromagnetic signal (not shown) when a target end-of-life condition exists; and monitoring the sputter target assembly () to detect the electromagnetic signal.