The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 20, 2006
Filed:
Sep. 18, 2003
Jeffrey D. Gelorme, Burlington, CT (US);
Hendrik F. Hamann, Yorktown Heights, NY (US);
Nancy C. Labianca, Yalesville, CT (US);
Yves C. Martin, Ossining, NY (US);
Theodore G. Van Kessel, Millbrook, NY (US);
Jeffrey D. Gelorme, Burlington, CT (US);
Hendrik F. Hamann, Yorktown Heights, NY (US);
Nancy C. LaBianca, Yalesville, CT (US);
Yves C. Martin, Ossining, NY (US);
Theodore G. Van Kessel, Millbrook, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A thermal interface for IC chip cooling is provided. One embodiment of the thermal interface includes a thermally conductive liquid or paste-like metal(s) disposed within a flexible, thermally conductive enclosure. The enclosure is adapted to be placed between an IC chip and a heat sink to enhance heat transfer from the chip to the heat sink, thereby enabling quicker and more efficient cooling of the chip than can be achieved by conventional techniques. In several embodiments, the thermal interface is held in place by mechanical pressure rather than by bonding, which further facilitates inspection and repair of the IC device.