The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 06, 2006
Filed:
Mar. 20, 2002
Tsunetoshi Arikado, Tokyo, JP;
Masao Iwase, Yokohama, JP;
Soichi Nadahara, Yokohama, JP;
Yuso Udo, Tokyo, JP;
Yukihiro Ushiku, Yokohama, JP;
Shinichi Nitta, Yokohama, JP;
Moriya Miyashita, Yokohama, JP;
Junji Sugamoto, Yokohama, JP;
Hiroaki Yamada, Yokohama, JP;
Hajime Nagano, Yokohama, JP;
Katsujiro Tanzawa, Yokohama, JP;
Hiroshi Matsushita, Yokohama, JP;
Norihiko Tsuchiya, Tokyo, JP;
Katsuya Okumura, Tokyo, JP;
Tsunetoshi Arikado, Tokyo, JP;
Masao Iwase, Yokohama, JP;
Soichi Nadahara, Yokohama, JP;
Yuso Udo, Tokyo, JP;
Yukihiro Ushiku, Yokohama, JP;
Shinichi Nitta, Yokohama, JP;
Moriya Miyashita, Yokohama, JP;
Junji Sugamoto, Yokohama, JP;
Hiroaki Yamada, Yokohama, JP;
Hajime Nagano, Yokohama, JP;
Katsujiro Tanzawa, Yokohama, JP;
Hiroshi Matsushita, Yokohama, JP;
Norihiko Tsuchiya, Tokyo, JP;
Katsuya Okumura, Tokyo, JP;
Kabushiki Kaisha Toshiba, Tokyo, JP;
Abstract
A semiconductor wafer has a bevel contour formed along the periphery thereof, products formed on the wafer, and an ID mark formed on the bevel contour. The ID mark shows at least the properties, manufacturing conditions, and test results of the products.