The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 06, 2006
Filed:
Sep. 14, 2004
Rajasekhar Venigalla, Wappingers Falls, NY (US);
James W. Hannah, Ossining, NY (US);
Timothy M. Mccormack, Poughkeepsie, NY (US);
Robert M. Merkling, Jr., Danbury, CT (US);
Rajasekhar Venigalla, Wappingers Falls, NY (US);
James W. Hannah, Ossining, NY (US);
Timothy M. McCormack, Poughkeepsie, NY (US);
Robert M. Merkling, Jr., Danbury, CT (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
By adding silica to ceria-based CMP slurries the polish process starts much faster than without silica thereby eliminating dead time in the polish process and eliminating process instability caused by changes in the dead time with operating conditions. A slurry for performing chemical mechanical polishing (CMP) of patterned oxides (e.g., STI, PMD, ILD) on a substrate, comprises: ceria particles having a concentration of 1.0–5.0 wt % and silica particles having a concentration of 0.1–5.0 wt %. A ratio of ceria concentration to silica concentration (ceria:silica) is from approximately 10:1 to nearly 1:1 by weight. The ceria particles have a particle size of 150–250 nm, and the silica particles have a particle size of greater than 100 nm. The silica may be fumed or colloidal. The slurry has a pH of approximately 9.0.