The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 23, 2006
Filed:
Feb. 03, 2004
Applicants:
Shih-ping Hsu, Hsin-chu, TW;
Lin-yin Wong, Hsin-chu, TW;
Inventors:
Shih-Ping Hsu, Hsin-chu, TW;
Lin-Yin Wong, Hsin-chu, TW;
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
Abstract
A heat sink structure with embedded electronic components is proposed, wherein a plurality of recessed cavities are formed on a heat sink for embedding the electronic components and receiving at least one semiconductor chip therein. This arrangement enhances electric performance of a semiconductor package with the above heat sink structure and improves heat dissipating efficiency of the semiconductor package.
Hsu, Shih-Ping. (2006). Heat sink structure with embedded electronic components for semiconductor package (U.S. Patent No. 7050304). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7050304
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile