The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 09, 2006
Filed:
Aug. 02, 2002
Young Ho Kim, Seoul, KR;
Seok Hyun Choi, Seoul, KR;
Choon Heung Lee, Seoul, KR;
Sung Su Park, Seoul, KR;
Sung Soon Park, Seoul, KR;
Young Ho Kim, Seoul, KR;
Seok Hyun Choi, Seoul, KR;
Choon Heung Lee, Seoul, KR;
Sung Su Park, Seoul, KR;
Sung Soon Park, Seoul, KR;
Amkor Technology, Inc., Chandler, AZ (US);
Abstract
A semiconductor package and method of producing the same has a semiconductor die having a first face and a second face. A coating material is coupled to the second face of the semiconductor die. A substrate having a cavity is provided wherein the semiconductor die is placed within the cavity. An encapsulant is used to encapsulate the second face of the semiconductor die placed in the cavity. Connection members are provided to couple the semiconductor die and the substrate in order to transfer signals between the semiconductor die and the substrate. Terminal members are couple to the substrate to connect the semiconductor package to an external device. In the semiconductor package, a thermal expansion coefficient of the coating material C and a thermal expansion coefficient of the encapsulant E should be approximately equal in value in order to limit the problems associated with warpage.