The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 09, 2006
Filed:
Jun. 30, 2003
Applicants:
Omer Dokumaci, Wappingers Falls, NY (US);
Bruce Doris, Brewster, NY (US);
David Horak, Essex Junction, VT (US);
Fen F. Jamin, Wappingers Falls, NY (US);
Inventors:
Omer Dokumaci, Wappingers Falls, NY (US);
Bruce Doris, Brewster, NY (US);
David Horak, Essex Junction, VT (US);
Fen F. Jamin, Wappingers Falls, NY (US);
Assignee:
International Business Machines Corporation, Armonk, NY (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10L 21/302 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method of planarization allows for the use of chemical mechanical polishing (CMP) in starting structures having films not generally suitable for CMP processes. Two material layers are formed over a starting structure, and the upper layer is planarized in a CMP process. A nonselective etch is then used to transfer the planar topography to the lower level.