The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 09, 2006
Filed:
Oct. 22, 2003
Masato Yamada, Annaka, JP;
Jun-ya Ishizaki, Annaka, JP;
Nobuhiko Noto, Annaka, JP;
Kazunori Hagimoto, Annaka, JP;
Shinji Nozaki, Kawasaki, JP;
Kazuo Uchida, Tokyo, JP;
Hiroshi Morisaki, Tsurugashima, JP;
Masato Yamada, Annaka, JP;
Jun-ya Ishizaki, Annaka, JP;
Nobuhiko Noto, Annaka, JP;
Kazunori Hagimoto, Annaka, JP;
Shinji Nozaki, Kawasaki, JP;
Kazuo Uchida, Tokyo, JP;
Hiroshi Morisaki, Tsurugashima, JP;
Shin-Etsu Handotai Co., Ltd., Tokyo, JP;
Nanoteco Corporation, Tokyo, JP;
Abstract
In a light-emitting device, a light-emitting layer portion composed of a compound semiconductor is bonded on one main surface of a transparent conductive semiconductor substrate while placing a substrate-bonding conductive oxide layer composed of a conductive oxide in between. Between the light-emitting layer portion and the substrate-bonding conductive oxide layer, a contact layer for reducing junction resistance with the substrate-bonding conductive oxide layer so as to contact with the substrate-bonding conductive oxide layer. This is successful in providing the light-emitting device which is producible at low costs, has a low series resistance, and can attain a sufficient emission efficiency despite it has a thick current-spreading layer.