The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7040011 B1

PDF
Full Text
Expired
Date of Patent:
May. 09, 2006

Filed:

Jan. 15, 2002
Applicants:

Toshihiko Tanaka, Tokyo, JP;

Masaharu Kubo, Hachioji, JP;

Takashi Hattori, Musashimurayama, JP;

Inventors:

Toshihiko Tanaka, Tokyo, JP;

Masaharu Kubo, Hachioji, JP;

Takashi Hattori, Musashimurayama, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 3/30 (2006.01);
U.S. Cl.
CPC ...
Abstract

A wiring substrate is manufactured in short TAT. Wirings of the wiring substrate are formed by an exposure treatment using a photomask which has shade patterns each containing at least nano particles and a binder.


Find Patent Forward Citations

Tanaka, Toshihiko. (2006). Wiring substrate manufacturing method (U.S. Patent No. 7040011). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7040011

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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