The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 02, 2006
Filed:
Dec. 15, 2003
Yuzhuo LI, Potsdam, NY (US);
Atanu Roy Chowdhury, Potsdam, NY (US);
Kwok Tang, Mississauga, CA;
Guomin Bian, Toronto, CA;
Krishnayya Cheemalapati, Potsdam, NY (US);
Yuzhuo Li, Potsdam, NY (US);
Atanu Roy Chowdhury, Potsdam, NY (US);
Kwok Tang, Mississauga, CA;
Guomin Bian, Toronto, CA;
Krishnayya Cheemalapati, Potsdam, NY (US);
Dynea Chemicals Oy, Helsinki, FI;
Abstract
An abrasive composition comprising non-polymeric organic particles that is useful for chemical mechanical planarization (CMP), and which can widely be used in the semiconductor industry. The inventive compositions preferably comprise soft water in combination with 0.001–20 w/w % of non-polymeric organic particles, 0.1–10 w/w % of an oxidizing agent, 0.05–10 w/w % of a chelating agent, 0.01–10 w/w % of a surfactant, and 0–10 w/w % of a passivation agent at a pH in the range of 2–12, wherein said percentages are w/w (weight/weight) percentages, based on the total weight of said compositions. The abrasive compositions provide an efficient polishing rate, excellent selectivity and good surface quality when utilized as a new abrasive composition in CMP applications.