The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 25, 2006
Filed:
Sep. 22, 2003
Robert J. Small, Dublin, CA (US);
Maria Peterson, Belmont, CA (US);
Tuan Truong, San Jose, CA (US);
Melvin Keith Carter, Los Gatos, CA (US);
Lily Yao, Newark, CA (US);
Robert J. Small, Dublin, CA (US);
Maria Peterson, Belmont, CA (US);
Tuan Truong, San Jose, CA (US);
Melvin Keith Carter, Los Gatos, CA (US);
Lily Yao, Newark, CA (US);
DANanoMaterials LLC, Tempe, AZ (US);
Abstract
The present invention relates to compositions for the chemical mechanical planarization ('CMP') of barrier/adhesion layers, particularly Ta/TaN barrier/adhesion layers as occur in the manufacture of integrated circuits. CMP compositions comprise an aqueous solution of oxidizer and colloidal silica abrasive. Oxidizers include hydroxylamine nitrate, nitric acid, benzotriazole, ammonium nitrate, aluminum nitrate, hydrazine and mixtures thereof in aqueous solution.